Some recent Samsung Exynos chips have suffered from overheating, but the company will apparently use PC-derived tech for future Exynos chips.
  • limerod@reddthat.comOPMEnglish
    0·
    3 days ago

    TL;DR

    • Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
    • This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
    • Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.
    • ForgotAboutDre@lemmy.worldEnglish
      0·
      3 days ago

      Rather than make better processors they just make them dispate heat better.

      These are also googles ‘own design processors’, so bad Samsung even avoids useing exynos. Next gen pixels will definitely be the hottest phone around.

      • limerod@reddthat.comOPMEnglish
        0·
        3 days ago

        If it was easy to make better processors everyone would be doing that. The exynos 2400 improved much more compared to previous generations. Better heat spread will mean improved performance and thermals. As for efficiency newer nodes should improve on this front.

      • henfredemars@infosec.pubEnglish
        0·
        3 days ago

        You can improve heat dissipation, but it’s going to cost battery life to produce that heat. This is not a great solution. It’s a mitigation.